NANOTHERM

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Applications: Nanotherm DMS addresses the unique thermal challenges of UV LEDs

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Applications: Nanotherm LC takes the heat out of urban farming

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Case Study: Nanotherm LC - at the heart of Lighthouse LED lighting

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Analysis: Cost and Performance of Thermal Management Solutions for High Power LEDs

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White Paper: High Efficiency UV LED Enabled by Next Generation Substrates

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LIA tests show Nanotherm LC runs up to 47° cooler than competing solutions

Cambridge Nanotherm produces the industry’s most efficient thermal management technology for LED applications and high powered electronics. A patented electro-chemical oxidation (ECO) process creates a super-thin ceramic layer on the surface of aluminium to form a nanoceramic dielectric with ultra-high thermal conductivity.

This nanoceramic dielectric can be applied as thin as 10µm – many times thinner than conventional dielectrics. The combination of the thinnest dielectric layer in the industry with the highest thermal conductivity yields the lowest thermal resistance of any Metal Clad PCB (MCPCB) substrate.

Press

20
JUN
2017

Cambridge Nanotherm partners with Inabata for global sales and distribution

Partnership with Japanese distribution giant brings significant sales and distribution channel to thermal management specialists Inabata on track to bring Nanotherm’s unique thermal management solution to a wide range of global markets Cambridge Nanotherm, producer of innovative...
22
MAY
2017

Cambridge Nanotherm launches Nanotherm DMS for UV LED applications

Thermal management innovator Cambridge Nanotherm today announces the launch of Nanotherm DMS, a unique Direct Metallised Single-sided thermal management solution that addresses the challenges created by UV LED modules. Ultraviolet (UV) light has key applications for curing resins...
05
APR
2017

Nanotherm presenting at LED Professional Symposium

Our roving applications manager, Dr Giles Humpston, will be presenting a paper called: “Thermal Management for Chip-Scale Packaged Lighting Modules” at the LED Professional Symposium in Bregenz, Austria, disusing the opportunities and thermal challenges presented by...

In the News

13
JUN
2017

Chip Scale Review: Tackling the thermal challenge chip-scale packaging creates for high-power LEDs

While chip-scale packaging (CSP) has been around since the 1990s (and in production since the early 2000s), the LED industry has only adopted CSP approaches in earnest within the last few years. Read the full artcile by our Applications Manager, Dr Giles Humpston in the Chip...
07
APR
2017

LED Journal: 2 oz, or Not 2 oz: That is the Question?

A variation of this question vexed Prince Hamlet while the modern version unsettles many a LED PCB designer. It’s all about copper thickness. When designing a PCB for LEDs, what weight of copper should be specified? Read the full post on the LED Journal website.
24
MAR
2017

CiE: Horticultural lighting is heating up

With innovations in LED grow lighting, society is on the cusp of a revolution in horticultural production. But, says John Cafferkey, marketing manager of Cambridge Nanotherm, the success of this revolution may hinge on finding ways to improve the thermal efficiency of L...

The Technology

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