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PRODUCTS
Nanotherm products range from unique PCB board material to insulated heatsinks with record high thermal conductivity.

NANOTHERM™ – MB PCB MATERIAL
NANOTHERM™ substrate technology uses a patented nano-ceramic coating process to create a dielectric layer on the surface of an Aluminium substrate, creates a circuit layer for the interconnection of electronic devices. 

The nano-ceramic layer achieves an industry-leading thermal resistance due to it being between 4 and 10 times thinner than its competitors. The dielectric thermal conductivity is also 2-3 times higher (7W/mK) than conventional PCB dielectric materials.
  The NANOTHERM™ Metal-Backed PCB (MBPCB) is nano-ceramic dielectric layer formed directly on the surface of Aluminium substrate.  A subsequent metallisation layer, formed on the surface of NANOTHERM™ ceramic coating by bonding an ultra-thin (4-10 microns) layer of adhesive to create a circuit layer  uses an ultra-thin bond line to attach Copper foil metallisation. This can be patterned using standard PCB processing techniques.




Nanoceramic layers formed directly on an aluminium base of required shape enable the development of a new class electronic substrates with outstanding thermal conductivity and dielectric strength. These properties are well above those properties of standard Metal Core Printed Circuit Board (MC PCB) dielectrics as well as anodic and Micro Arc Oxide materials.

CHIP-ON-HEAT SINK

Chip-on-Heat Sink design for LED Light Engines
Placing LED chip directly on a heat sink provides the shortest thermal pass and offers an optimal thermal management solution for investigated LED devices. Electrical insulation of a conventional Aluminium heat sink is provided by application of a dielectric ceramic layer directly on its surface.

 

TECHNOLOGY
The Company has developed and patented a novel electro-chemical process for forming nanoceramic dielectric layers directly onto an aluminium base of arbitrary shape.
Technology is principally different from anodising, microarc oxidation or galvanic deposition and produces dense nano-crystalline oxide with high thermal conductivity and dielectric strength. X-ray analysis of nano-ceramic layers demonstrated that ceramic layer consists of aluminium oxide crystallites with average size of around 200 - 600Å (that is 20-60 nm).  
  The compact nano-crystalline structure of the developed ceramic material explains its high thermal conductivity (7 W/mK) and high dielectric strength (60-110 KV/mm) which are significantly above those properties of MC PCB dielectrics as well as anodic and Micro Arc Oxide coatings.

Due to the fully inorganic nature of the material, nanoceramic-aluminium substrates can work at high temperatures which are limited only by the working temperature of aluminium base and material properties are not affected by thermal degradation.


 

 

Nanoceramic layers formed directly on an aluminium base of required shape enable the development of a new class electronic substrates with outstanding thermal conductivity and dielectric strength. These properties are well above those properties of standard Metal Core Printed Circuit Board (MC PCB) dielectrics as well as anodic and Micro Arc Oxide materials.

NEWS AND EVENTS
Cambridge Nanotherm® Products Receive UL® Recognition

Haverhill, Suffolk UK, 30th April 2014 – Electronics thermal management innovator Cambridge Nanotherm® Ltd has announced that UL® has given recognised status to its Nanotherm® Laminated Copper (LC) thermal management products.
The recognition assures that the products have been found to be effective and safe after being subject to tests by UL International (UK) Ltd. The environmentally-friendly thermal management substrate solutions are enabling customers to add another high-performance material choice to their design tool box. The Nanotherm® LC material not only allows the customer to create a design based upon a conventional PCB, but also the ability to add the circuit to any 3D shape – creating a Circuit-on-Heat Sink solution.


Our unique nano-ceramic materials make electronic and LED devices shine brighter, last longer or function far more efficiently. We provide solutions to complex power consumption problems in the automotive, industrial and consumer domains, with a technology portfolio that includes Nanotherm LC (Laminated Copper) – a high-performance MCPCB (metal core PCB) for thermally challenging electronics.
Steven Curtis, Cambridge Nanotherm’s Chief Engineering Officer, commented, “This is fantastic news for ourselves and our customers. It gives them the confidence to use our materials in their thermally challenging designs knowing that they have met UL’s stringent electrical and flammability standards.”
Nanotherm® Technology
Nanotherm® ceramic is grown on the surface of aluminium to create a dielectric layer directly onto the surface of an aluminium substrate. The nano-ceramic dielectric layer is between two and 10 times thinner than the competition and achieves an industry-leading thermal resistance of 0.014 oCcm2/W. The dielectric has a thermal conductivity of 7 W/mK which is 2-3 times more effective at heat dissipation than conventional MB PCB (metal back printed circuit board) dielectric materials.
For more information on Cambridge Nanotherm®, its technology and products please contact Karen Parnell or Visit our website www.camnano.com.


Learn more about our technology https://www.youtube.com/watch?v=vV6xFl2_V-U
For photos of our products and Steve Curtis: http://www.camnano.com/newpressimages.zip
About Cambridge Nanotherm® Ltd
Cambridge Nanotherm® is a global provider of innovative thermal management solutions for lighting, power semiconductors, automotive and consumer applications. Our unique nano-ceramic materials make electronic and LED devices shine brighter, last longer or function far more efficiently. We provide solutions to complex power consumption problems in the automotive, industrial and consumer domains, with a technology portfolio that includes Nanotherm LC (Laminated Copper) – a high-performance MCPCB (metal core PCB) for thermally challenging electronics; Nanotherm 3D which enables circuits to be built directly onto 3D heat sinks; and Nanotherm DM (Direct Metal) – the ultimate thermal management solution for applications which normally require prohibitively expensive Aluminium Nitride materials.
More information can be found at www.camnano.com. Keep up to date with Cambridge Nanotherm on our technical blog on Linkedin, Youtube or follow us on Twitter at twitter.com/camnano.

In 2013 the company was recognized with a prestigious Frost & Sullivan award for innovation in the thermal management of LEDs. The company was the UK winner of the 2011 Clean Tech Open Competition, sponsored by Silicon Valley Bank, TSB and Carbon Trust. The company was supported by TSB, EEDA New Anglia LEP and ERDF grants and was a member of the Carbon Trust Fast-track Entrepreneur Programme. Since 2011, Cambridge Nanotherm® Ltd has been financially backed by Enso Ventures.
 

Cambridge Nanotherm® opens World’s first electro-chemical nano-ceramic production line for electronic substrate solutions.

Nanotherm® production line extends the applications of this award winning patented technology beyond LED lighting to wider electronic substrate applications that require higher thermal management, lower cost of ownership and smaller footprints

 

Haverhill, UK March 26th 2014 – Cambridge Nanotherm®, the manufacturer of advanced Aluminium Nano-Ceramic substrate technology for the thermal management of electronic applications, installs the first of many fully automated lines.

The first application of this technology is effective heat dissipation for LED lighting which has been proven to reduce the operating temperature by 20% which can extend the life of the LED or allow it to be driven harder to produce more light per device and be more energy efficient. The next production line is already being planned so that this unique technology can be extended to other applications such as thermal management for power electronics and other electronics applications.
Dr Pavel Shashkov, Founding Director, said “I am extremely proud to formally open the first of many production lines. Nanotherm® is truly unique and will revolutionise the electronics substrate business. This innovative technology is set to change the way we think about every day products like LED lights and will allow them to last much longer and shine brighter with less energy consumption.”
Cambridge Nanotherm® Ltd’s R&D engineers started to develop the technology back in 2010 and from there were recognised with a prestigious Frost & Sullivan award for innovation in 2013. The company has successfully taken the technology from R&D to production in just three years. This journey to the prototype production line was helped with a grant from the Technology Strategy Board (TSB).
Financial backers, ENSO Ventures, really believed in the technology and made major investments into the new 1000m2 facility and commissioned the first fully automated production line specifically designed for the Patented Nano-Ceramic manufacturing process. The new facility was also supported by New Anglia Local Enterprise Partnership through the Growing Business Fund.
 
Nanotherm® Technology
Nanotherm® ceramic is grown on the surface of aluminium to create a dielectric layer directly onto the surface of an aluminium substrate. The nano-ceramic dielectric layer is between two and 10 times thinner than the competition and achieves an industry-leading thermal resistance of 0.014 oCcm2/W. The dielectric has a thermal conductivity of 7 W/mK which is 2-3 times more effective at heat dissipation than conventional MB PCB (metal back printed circuit board) dielectric materials.
For more information on Cambridge Nanotherm®, it’s technology and products please contact Keith McDonald or Visit our website www.camnano.com.

Keith McDonald
VP Sales & Marketing
M: +49 1753 659 663
E: info@camnano.com

About Cambridge Nanotherm® Ltd
Cambridge Nanotherm® Ltd, was established in 2010 to commercialise proprietary nano-ceramic technology for use in the electronic industry. The company was the UK winner of the 2011 Clean Tech Open Competition, sponsored by Silicon Valley Bank, TSB and Carbon Trust. In 2013 the company was recognized with a prestigious Frost & Sullivan award for innovation in the thermal management of LEDs. The technology has been developed by internationally renowned scientists who have a track record for setting up successful high technology companies and commercialising innovative IP. The company was supported by TSB, EEDA New Anglia LEP and ERDF grants and was a member of the Carbon Trust Fast-track Entrepreneur Programme. Since 2011, Cambridge Nanotherm® Ltd has been financially backed by Enso Ventures. www.camnano.com
 

Cambridge Nanotherm wins the Frost & Sullivan award for innovation in the thermal management of LED lighting

NANOTHERM™ wins Frost & Sullivan Innovation Award
for Chip-on-Heat-Sink technology
Aluminium-ceramic substrate combines ultra-low thermal resistance
with high dielectric strength at lower cost than comparable technology


Haverhill, UK, 17 October 2013 – Cambridge Nanotherm, the manufacturer of advanced substrates for high-temperature electronics, has won a Frost & Sullivan Innovation Award for Chip-on-Heat-Sink designs enabled by NANOTHERM™, a substrate technology that combines ultra-low thermal resistance with high dielectric strength.

Manufacturers of electronic devices that run hot, such as power supplies, power LEDs and thermoelectric circuits, can achieve excellent thermal performance and electrical isolation by using NANOTHERM, at a substantially lower cost than comparable aluminium nitride-based substrates in use today.

By reducing the cost of producing a strong dielectric (75kV/mm) with ultra-low thermal resistance (0.02°Ccm2/W), Cambridge Nanotherm has thus brought high thermal performance within reach of a much wider range of applications.

NANOTHERM draws on a patented technique for growing a dielectric ceramic layer of nano-scale aluminium oxide crystals on aluminium of any shape. It enables precise control of the ceramic layer’s thickness to sub-micron tolerances, to produce substrates with precisely specified dielectric strength and thermal resistance.

In the Chip-on-Heat-Sink (CoHS) implementation cited by Frost & Sullivan, a NANOTHERM dielectric layer grown on a heat sink is combined with metallisation, which bonds a copper circuit layer to the dielectric.

This allows a chip to be mounted directly on a heat sink, eliminating the PCB and adhesive layers which are required in conventional assemblies, and which constrict the flow of heat from the chip to the heat sink.

Frost & Sullivan has recognised the value of this technology to manufacturers of LED lighting equipment, awarding Cambridge Nanotherm its 2013 European Thermal Management Solutions for LED Lighting Technology Innovation Award.

Describing NANOTHERM CoHS technology, Frost & Sullivan says: ‘The temperature at which the LED die runs is lowered by up to 22°C. As such, higher power can be pushed to the LED, thus increasing its light output. This in turn means customers can operate fewer LEDs but get higher light output at the same time.

‘Running the LED die at cooler temperatures also offers higher reliability to customers… Cambridge Nanotherm’s technology would help manufacturers extend the warranty on their LED products.’

Steven Curtis, Chief Engineering Officer at Cambridge Nanotherm, said: ‘This Frost & Sullivan innovation award is a testament to the huge impact NANOTHERM is set to make across of a wide range of high-temperature electronics applications. Until now, the very high thermal performance of advanced dielectric materials has only been matched by their very high price.

‘The innovative mass-production techniques underpinning our NANOTHERM technology mean that a dielectric offering negligible thermal resistance is now available to every mainstream and cost-sensitive application.’

Products based on NANOTHERM technology are available now in production volumes. These include isolated heat sinks, CoHS implementations, substrates for hybrid circuits, and lightweight replacements for direct-bonded copper substrate.


About Cambridge Nanotherm
Cambridge Nanotherm has developed a patented process for growing a nano-scale crystalline ceramic layer on aluminium to form a substrate for electronic circuits. Because it can be made as little as 5 microns thick, this NANOTHERM™ ceramic layer offers excellent thermal conductivity while also providing high dielectric strength.

Benefiting from low-cost production techniques, NANOTHERM offers high thermal and electrical performance at a lower cost than conventional aluminium nitride technology.

Cambridge Nanotherm has its headquarters and research facilities in Haverhill, near Cambridge, UK, and production facilities in the UK. Its website can be found at www.camnano.com.

contact:
Karen Parnell
Marketing Manager
T: +44 (0) 1440 765 520
E: info@camnano.com

 

Cambridge Nanotherm appoints new Sales and Marketing Director to drive global business expansion

Haverhill, Suffolk UK, 17th July 2013 – Electronics thermal management innovator Cambridge Nanotherm has appointed Keith McDonald as Sales and Marketing Director to spearhead the company’s global business development.

In line with the company’s growth ambitions, Keith will be responsible for growing the company’s sales by broadening both its market penetration and the applications in which its Nanoceramic-on-Aluminium substrate technology is used.

Keith has a global track record of establishing significant and sustainable growth within the thermal management market. He has held senior positions with the world’s two largest TIM/TCPCB (thermal interface materials/thermally conductive printed circuit boards) companies.

In his previous role as Vice President of Sales for Laird Technologies’ Thermal Division, Keith achieved consecutive record sales years which drove the company from ‘bit player’ status to being the world’s number two in the market for TIM products.

Prior to this Keith was UK Sales Manager for thermal management materials manufacturer Bergquist. In this role he successfully set strategy, built a strong sales team and significantly grew sales.

Commenting on his appointment Keith said: "The unique technology and product range of Cambridge Nanotherm is truly disruptive and provides an overall new paradigm for thermal management solutions, and I am confident that we can grow the company aggressively based on the interest from customers and thermal design houses.”

Pavel Shashkov, CEO and founder of Cambridge Nanotherm said: “Keith has a broad and deep knowledge of thermal materials, practical experience in identifying their optimal market applications and an amazing track record in growing - or rather multiplying - company sales turnover. His expertise will give Cambridge Nanotherm a new commercial dimension and will open up new global markets.”

About Cambridge Nanotherm Ltd:

Cambridge Nanotherm Ltd, was established in 2010 to commercialise proprietary nano-ceramic technology for use in the electronic industry. The company was the UK winner of the 2011 Clean Tech Open Competition, sponsored by Silicon Valley Bank. The technology has been developed by internationally renowned scientists who have a track record for setting up successful high technology companies and commercialising innovative IP. The company was supported by TSB, EEDA and ERDF grants and was a member of the Carbon Trust Fast-track Entrepreneur Programme. Since 2011, Cambridge Nanotherm Ltd has been financially backed by Enso Ventures.  www.camnano.com

Contact:

Karen Parnell
Marketing Manager
T: +44 (0) 1440 765 520
E: info@camnano.com

Cambridge Nanotherm Delivers the First Commercial Order for its Ground-breaking Chip-on-Heatsink Technology in partnership with Optocap

Haverhill, Suffolk. United Kingdom – June 26th, 2013 – Cambridge Nanotherm has announced, in partnership with Optocap, an advanced microelectronic and optoelectronic packaging design and assembly company, that the first ever Chip-on-Heatsink modules ordered have been shipped to a customer in the LED industry.

“As a design and assembly service provider we need to ensure we specify materials that will enhance our customers’ products,” said David Ruxton, CEO of Optocap. “We specified Cambridge Nanotherm’s technology due to the outstanding thermal performance it enables. It also means a reduced bill of materials, simplified supplier management and easier assembly for our customer.”

Cambridge Nanotherm’s core IP is a unique process for converting aluminium into alumina. The process allows the surface of any aluminium object to be converted into a dielectric layer. In the case of the Chip-on-Heatsink approach, an extruded heat sink or heat pipe can be coated and then metallised with the end user’s circuit design. Nanotherm’s technology enabled Optocap to utilise its advanced manufacturing processes, allowing direct assembly of die and surface mount components onto the heat sink, creating a fully integrated module.

This approach gives a number of benefits for LED lighting customers. For those using conventional PCB materials and heat sinks, the advantages are three-fold: firstly, a cost reduction is seen by the removal of both the MCPCB and thermal interface material (TIM) components; secondly, the removal of these layers give the most efficient thermal path between component and heat sink; and finally, as a result of minimising thermal resistance, denser component layouts can be realised. For those using thick-film or thin-film metallised alumina and aluminium nitride ceramic heat sinks, the cost reduction is even more significant, while bulk thermal performance of the aluminium heat sink matches one made from aluminium nitride.

“We are very pleased to have Optocap as the world’s first commercial customer for the first ever Chip-on-Heatsink product,” said Cambridge Nanotherm CEO, Dr Pavel Shashkov. “Working with Optocap we were able to demonstrate that our product has clear technological advantages as well as real commercial benefits. We believe that this technology will change the rules of the game for manufacturers not just in the LED field but in the electronics industry as a whole”.

About Cambridge Nanotherm Ltd:

Cambridge Nanotherm Ltd, was established in 2010 to commercialise proprietary nano-ceramic technology for use in the electronic industry. The company was the UK winner of the 2011 Clean Tech Open Competition, sponsored by Silicon Valley Bank. The technology has been developed by internationally renowned scientists who have a track record for setting up successful high technology companies and commercialising innovative IP. The company was supported by TSB, EEDA and ERDF grants and was a member of the Carbon Trust Fast-track Entrepreneur Programme. From 2011 Cambridge Nanotherm Ltd has been financially backed by Enso Ventures. www.camnano.com

About Optocap Ltd:

Optocap Ltd provides contract package design and assembly services for microelectronic and optoelectronic devices. Optocap's turn-key packaging services enable our customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with new product developments

Contact:

contact:
Karen Parnell
Marketing Manager
T: +44 (0) 1440 765 520
E: info@camnano.com

 

 

 

 

Colin Dore, Business Development Manager info@camnano.com
3b Homefield Road,
Haverhill,
Suffolk. UK.

CB9 8QP
t: +44 (0)1440 762 159

www.camnano.com

 

 

Stephen Duffy,

Director of Sales and Marketing

Info@optocap.com

Optocap Ltd,

5 Bain Square,

Livingston, EH54 7DQ, Scotland, UK.

t: +44(0)1506403550

www.optocap.com

 

Cambridge Nanotherm establishes first step towards mass manufacturing

Haverhill, Suffolk UK, 15th May 2013 - Electronics thermal management innovator Cambridge Nanotherm is to build its first prototype manufacturing plant in Haverhill, UK following the award of £250,000 in matched funding from the UK Innovation Agency - Technology Strategy Board (TSB).

Cambridge Nanotherm, the winner of the 2011 UK Clean Tech Open Competition, has developed and patented a unique nanoceramic-aluminum substrate for thermal management of electronics which offers the potential for major cost reductions and environmental benefits in electronics manufacturing.

Nanotherm™ substrate technology uses a proprietary nano-ceramic coating process to create a dielectric layer directly on to the surface of an aluminium substrate. The nano-ceramic dielectric layer is between two and 10 times thinner than its competitors and achieves an industry-leading thermal resistance of 0.014 Ccm2/W. It also has a dielectric thermal conductivity of 7 W/mK which is 2-3 times higher than conventional MB PCB (metal back printed circuit board) dielectric materials.

With the financial support from the TSB and from Cambridge Nanotherm shareholder Enso Ventures, the new state-of-the-art facility will both be a development platform for electronic applications of Nanotherm technology such as LED lighting and power electronics; and demonstrate the manufacturability of Nanotherm™ substrates in a volume production environment to potential licensees of the technology.

The prototype manufacturing line will be capable of producing innovative MB PCB materials with ceramic dielectric as well as groundbreaking circuit-on-heat-sink substrates.

Pavel Shashkov, CEO and founder of Cambridge Nanotherm said: “The Nanotherm™ technology has the potential to change the way in which LED light fixtures and power electronic substrates are designed and manufactured because it delivers better thermal performance, lower overall cost, smaller footprint and flexible design. This new facility is a major next step in the development of our patented technology and of the Cambridge Nanotherm business.”

About Technology Strategy Board: 

The Technology Strategy Board (TSB) is a UK Innovation Agency, a public body operating at arm's length from the UK Government. TSB aim is to accelerate economic growth by stimulating and supporting business-led innovation. This aim is achieved by being a catalyst; by highlighting opportunities; by connecting partners and networks and by funding - helping businesses of every size to transform great ideas into the growth products and services of tomorrow.

www.innovateuk.org

 

About Cambridge Nanotherm Ltd:

Cambridge Nanotherm Ltd, was established in 2010 to commercialise proprietary nano-ceramic technology for use in the electronic industry. The company was the UK winner of the 2011 Clean Tech Open Competition, sponsored by Silicon Valley Bank. The technology has been developed by internationally renowned scientists who have a track record for setting up successful high technology companies and commercialising innovative IP. The company was supported by TSB, EEDA and ERDF grants and was a member of the Carbon Trust Fast-track Entrepreneur Programme. Cambridge Nanotherm Ltd is financially backed by Enso Ventures.

www.camnano.com

contact:
Karen Parnell
Marketing Manager
T: +44 (0) 1440 765 520
E: info@camnano.com

 

Colin Dore, Business Development Manager

info@camnano.com

3b Homefield Road, Haverhill, Suffolk. UK.

CB9 8QP

+44 (0) 208 330 4286

Cambridge Nanotherm and Spirit Circuits sign Value Added Reseller agreement

Southern Manufacturing Show, Farnborough UK – 14th February 2013 – Following the recent launch of its Nanotherm™ MBPCB (Metal-Backed Printed Circuit Board) product, Cambridge Nanotherm has signed its first value added reseller (VAR) agreement with UK-based printed circuit board (PCB) maker Spirit Circuits.

Cambridge Nanotherm has developed a unique process for converting Aluminium into Alumina (Aluminium Oxide [Al2O3]). The process allows the surface of an Aluminium plate to be converted into a layer of Alumina – which acts as a dielectric. A range of standard Printed Circuit Board fabrication techniques can then be used to apply circuitry onto the nano-ceramic dielectric layer.

“We are very pleased be the first Value Added Reseller of NanothermTM in UK as that will allow our customers access to this leading edge thermal management product,” said Steve Driver, Spirit’s Managing Director. “The Nanotherm product will provide our customers with better thermal performance and smaller footprints for thermally challenged designs in both the LED lighting and power electronics segment.”

Pavel Shashkov, Cambridge Nanotherm’s CEO said: “We are delighted to have signed this VAR agreement with Spirit. Their thermal management expertise and capability in the field of MBPCB will allow us to expand our access to market and provide their customers and design engineers with Nanotherm material for their demanding applications.”

 

About Spirit Circuits Ltd:

 

   

Spirit Circuits is a PCB and MBPCB manufacturer based in Waterlooville, Hampshire. They offer an extensive complement of PCB’s, from single sided through to complex multi-layers. They are certified by the internationally recognised ISO9001 quality standard. Spirit supply to the Telecoms, Defence, Medical, LED Lighting and Industrial Markets.

 

About Cambridge Nanotherm Ltd:

 

   

Cambridge Nanotherm Ltd, was established in 2010 to commercialise proprietary nano-ceramic technology for use in the electronic industry. The company was the UK winner of the 2011 Clean Tech Open Competition, sponsored by Silicon Valley Bank. The technology has been developed by internationally renowned scientists who have a track record for setting up successful high technology companies and commercialising innovative IP. The company was supported by TSB, EEDA and ERDF grants and was a member of the Carbon Trust Fast-track Entrepreneur Programme. Cambridge Nanotherm Ltd is financially backed by Enso Group.

www.camnano.com

contact:
Karen Parnell
Marketing Manager
T: +44 (0) 1440 765 520
E: info@camnano.com

 

Colin Dore, Business Development Manager

info@camnano.com

3b Homefield Road, Haverhill, Suffolk. UK.

CB9 8QP

+44 (0)1440 762 159

Cambridge Nanotherm Ltd launches its industry-leading Nanotherm™ Metal-backed PCB product which enables a reduction in LED device temperature of up to 20°C

Haverhill, Suffolk UK, January 14th 2013 – Cambridge Nanotherm has launched Nanotherm™ MBPCB (Metal-Backed Printed Circuit Board), the culmination of two years of innovative development using Cambridge Nanotherm’s ceramic dielectric technology. This has resulted in an innovative thermal management material, with a dielectric thermal conductivity of 7 W/mK, which is able to significantly reduce LED die temperatures – even in the most thermally challenging Luminaire designs.

The company’s core IP exists in its unique process for converting Aluminium into Alumina (Aluminium Oxide [Al2O3]). This process allows the surface of an Aluminium plate to be converted into a layer of Alumina – which acts as a dielectric. A range of standard Printed Circuit Board fabrication techniques can then be used to apply circuitry onto the nano-ceramic dielectric layer.

“This nano-ceramic dielectric not only provides excellent electrical isolation, but also has a thermal performance which is much improved over the standard filled epoxies used for conventional thermal management dielectrics”, explained Dr Pavel Shashkov, CEO and Founder, Cambridge Nanotherm. “The ceramic layer has a bulk thermal conductivity of 6-7 W/mK and can be applied in thicknesses as low as 10 micron, resulting in a thermal resistance as low as 0.012°Ccm 2 /W.”

Independent testing of the Nanotherm™ MBPCB, in LED lighting applications, has shown that it offers a 20% reduction in substrate thermal resistance over some of the best available metal-backed PCBs. In back-to-back comparison testing with other metal-backed PCBs, LED temperatures were seen to be reduced by as much as 20°C, thus allowing designers to increase component density and power or give longer lifetime guarantees.

Cambridge Nanotherm sees its new thermal management material as an important addition to its customers’ material toolboxes – reducing the need to move to more expensive Copper-backed PCBs as thermal challenges arise.

Steven Curtis, Nanotherm’s Head of Product Development added: “We are quickly moving ahead with the development of our next generation product, Nanotherm™ PLUS, which, by direct metallisation of the nano-ceramic layer, produces an MBPCB with a thermal performance approaching that of Aluminium Nitride (AlN) ceramic tile.

“This substrate material will offer an alternative to those designers who need the excellent performance of AlN in their packages or arrays, but need to meet very tight cost targets.”

 

About Cambridge Nanotherm Ltd:

 

Cambridge Nanotherm Ltd, was established in 2010 to commercialise proprietary nano-ceramic technology for use in the electronic industry. The company was the UK winner of the 2011 Clean Tech Open Competition, sponsored by Silicon Valley Bank. The technology has been developed by internationally renowned scientists who have a track record for setting up successful high technology companies and commercialising innovative IP. The company was supported by TSB, EEDA and ERDF grants and was a member of the Carbon Trust Fast-track Entrepreneur Programme. Cambridge Nanotherm Ltd is financially backed by Enso Group. www.camnano.com

Contact:

Camille Closs

+44 (0)20 8286 0654

Watch PR

camille@watchpr.com

 

Colin Dore, Business Development Manager

info@camnano.com

3b Homefield Road,

Haverhill,

Suffolk UK

First LED chip-on-Al heatsink device produced and evaluated

19-21  September 2012, participation at “Strategies in Light Europe 2012”, Munich.  Visit our booth B35 
http://www.sileurope.com/index.html

CN presents “Nanoceramic Aluminium Substrates”

CN presents “Nanoceramic Aluminium Substrates” at Smart Lighting Conference, Dusseldorf, Germany

Cambridge Nanotherm comes second in the Global Cleantech Ideas Final

Cambridge Nanotherm comes second in the Global Cleantech Ideas Final, San Jose, USA.

http://www.cleantechopen.com/app.cgi/news/press_releases/75/view

 

CN secures its funding first round with ENSO Ventures.

CN secures its funding first round with ENSO Ventures.

Cambridge Nanotherm becomes a Winner of UK Cleantech Ideas Competition 2011

Cambridge Nanotherm becomes a Winner of UK Cleantech Ideas Competition 2011.

http://www.thelongrunventure.com/ideas/finalists/

Strategies in Light Europe Conference

Strategies in Light Europe Conference

http://www.sileurope.com


Presentation “Nanoceramic-Aluminium Substrates for Solid State Lighting” , Cambridge Nanotherm

Successful completion of TSB project on investigation of properties of nanoceramic – aluminium

Successful completion of TSB project on investigation of properties of nanoceramic – aluminium. Direct measurement of LED based on nanoceramic demonstrated 23C LED temperature reduction compared with traditional PCB board.

Cambridge News “Cambridge leads way in clean tech industry”

Cambridge News “Cambridge leads way in clean tech industry”. First demonstration of Nanoceramic LED Substrate at Cambridge Smartlife Centre.

ABOUT US

Cambridge Nanotherm Ltd, was established in 2010 to commercialise proprietary nano-ceramic technology for use in the electronic industry. The technology has been developed by internationally renowned scientists who are co-founders of the company. The management team has a track record for setting up successful high technology companies and commercialising innovative IP. The core team previously started businesses in Cambridge.

In Novermber 2011 Enso Ventures Limitied, a private equity and technology boutique firm, became an investor in Cambridge Nanotherm. 

The Management Team:

Dr. Pavel Shashkov

CEO & FOUNDER

Over 20 years of experience in building and running high tech companies. 

 

Marek Stuchlik, PHD

VP Manufacturing 

Cambridge Graduate with 7 years experience within the ceramic coatings industry.

 

Adrian Smith FMCA CGMA  

Financial Controller

30 years experience of commercial management within manufacturing industries. 

 

Sergey Usov

VP Operations

Technology, manufacturing and licensing expert.

 

 

Steven Curtis 

VP Product Development

17 years of product development and manufacturing experience.

 

Keith McDonald

Sales & Marketing Director

30 years sales management experience, with past 10 years specialised in thermal management solutions.

 

 

Board:

 Nikolay Danilov

 Director

Enterpreneur and investor. Managing Director of Enso Ventures.

 

 

 

Kim Berknov

 Director

Over 15 years of venture capital and corporate finance experience. Partner at Enso Ventures.

 

Kirill Mudryy

 Director

Qualified solicitor. Investment Manager at Enso Ventures.

 

Dr. Pavel Shashkov

CEO & FOUNDER

Over 20 years of experience in building and running high tech companies. 

 

Sergey Usov

VP Operations

Technology, manufacturing and licensing expert.

 

 

 

 

CONTACT
Cambridge Nanotherm Limited


Homefield Road,

Haverhill,

Suffolk

CB9 8QP

United Kingdom

T +44 (0)1440 765 520
F +44 (0)1440 765 527
info@camnano.com
www.camnano.com