As LED brightness has increased, manufacturers have been forced to move to high performance LED packaging substrates. Today, the high-brightness LED (HB-LED) packaging market is dominated by LED packaging substrates such as aluminium nitride (AIN) which are excellent thermal conductors whilst offering solid dielectric properties. The only downside has been the price. AIN is a phenomenally costly material to produce. Indeed, it is so difficult to produce pure aluminium nitride that few suppliers can deliver it in pure form – compromising the thermal performance of the material.
Up until now there have been very few alternatives which can take the heat – and so it has not been possible to reduce the costs of an expensive part of the LED assembly, despite the intense price pressure the LED market is under.
Now Nanotherm offers a new approach. Our Nanotherm DM (Direct Metal) Nanoceramic substrates provide a similar thermal profile to AIN but at a far more compelling price/performance ratio. Copper circuits are sputtered onto a super-thin dielectric of nano-crystalline alumina on an aluminium carrier. The combination has thermal conductivity close to that of the aluminium core itself.
This game changing development means LED manufacturers can build LED packages at a significantly lower cost, helping bring the overall price point of LEDs down.
Replacing AlN ceramic substrates in high-brightness LEDs with an advanced sandwich of copper, aluminium and Nanoceramic not only offers a significant cost advantage; the material can also be significantly thinner, as it does not suffer from the brittleness or thermal fatigue that plagues ceramic packaging substrates. Thermal performance gets another boost – and production yields are higher – as a consequence.
If you’d like details of how Nanotherm DM can meet your LED packaging requirements please call us on +44 (0)1440 765 520 or send us an email.