As applications like electric vehicles and photo-voltaic (PV) solar panels continue to mature they are driving up demand for the power electronics components that lie at their heart. IGBT and MOSFET semiconductors enable these technologies to control and convert electric power and, according to market research company Yole Development, the market for these devices is expected to grow to $17.2B by 2020.
Applications that use power electronics are in the ascendancy: in particular photo-voltaic, hybrid and electric vehicles, and wind turbines. PV and electric vehicles account for well over half the power electronics market and growing as alternative energy applications take over from carbon-based. With continued effort to move to a low carbon economy expect these markets to flourish as they become an ever larger part of the energy mix.
However, there is a downside for power electronics component manufacturers. With the increase in volume comes significant price pressure. To keep margins healthy power electronics manufactures will need to find creative approaches to take cost out of their products without impacting on their performance. One area where there’s the potential to make some significant cost savings is in the component packaging.
The bulk of power electronics modules use aluminium nitride (AIN) as a substrate. Whilst AIN is an excellent choice of material in terms of material properties (it’s extremely thermally conductive and it has very high electrical breakdown voltage) AIN is also extremely expensive. Nanotherm offer an alternative approach that can help reduce cost without any disruption.
Nanotherm DM, our award winning direct bonded copper substrate, can be used as a alternative to AIN. With ground breaking thermal conductivity of 152W/mK Nanotherm DM can cope with all but the most extreme thermal management challenges.
Interested to find out what Nanotherm could do you your applications? Why not give us a call on +44 (0)1440 765 520 or send us an email.