Nanotherm DM is an award winning product developed to fill a gap in the market for high-technology thermal management substrates. The extraordinary thermal performance of Nanotherm DM places it alongside electronics grade ceramics such as aluminium nitride (AIN) making it ideal for use in thermally demanding semiconductor applications such as high power LED packaging and for UV LED modules.
Whilst Nanotherm DM offers the performance of aluminium nitride it has the robustness, area dimensions and manufacturability of a standard aluminium Metal Clad PCB (MCPCB).
How it’s made
The Nanoceramic layer on Nanotherm DM is grown using our patented ECO process converting the surface of the aluminium into an alumina (AL2O3) dielectric. Nanotherm DM is a fully inorganic product and uses a direct metallisation, or thin-film, process to build the copper circuit layer. This enables Nanotherm DM to reach an unprecedented composite thermal performance of 152W/mK with thermal resistance as low as 0.09 K/W for a single-sided circuit on a 1.5mm aluminium board. This is close to high quality AlN ceramic and far exceeds the performance of alumina substrates.
We work with the world’s leading thin-film direct metalisation manufacturers to circuitise Nanotherm DM. The process atomically bonds the circuit to the ceramic creating the best possible thermal performance and adhesion. The process builds incredibly high definition circuits so the track and gap definition can be much finer than possible with a standard PCB reductive process. This is a key requirement for the die-level semiconductor industry – particularly High-Power LED packaging and some Chip-on-Board (COB) LED applications.
Through holes and features
Nanotherm’s technology makes the manufacture of electrically isolated through holes for double-sided circuits very straightforward. Holes are either mechanically or laser drilled prior to the ECO process. When the aluminium undergoes the Nanoceramic conversion it converts the surface of the holes in exactly the same way as it does any other surface. This gives a perfect dielectric finish through the thickness so when the material is circuitised the holes can be filled with copper creating the connections for a double-sided circuit.
One of the outstanding attributes of Nanotherm DM is its mechanical properties. As it’s predominantly aluminium it’s incredibly robust, in marked contrast to brittle ceramics. This helps to increase yields as it lessens breakages and makes the material easier to handle along the supply chain. Nanotherm DM can also be manufactured in large panels which in turn means that manufacturers can fit more circuits onto a unit. This brings previously impossible economies of scale to the market which can help to reduce costs further still.
- Composite thermal conductivity: 152 W/mK
- Nanoceramic dielectric thermal conductivity: 7 W/mK
- High operating temperature: 350 °C
- Pb-free solder compatible
- ROHS compliant