Thin-Film Substrate

DM

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Features

  • Layer of electrically isolating alumina (Al2O3) formed on an aluminium base
  • Direct metallisation on alumina
  • Composite thermal conductivity: 152 W/m 
  • Operating temperature: 350 °C 

Applications

  • LED chips  packaging substrate
  • UV LEDs
  • Chip Scale Packaged (CSP) modules
  • Chip-on-Board LED (COB LED) modules
  • High density LED modules
  • Automotive Lighting modules
Item Value Unit Condition Method
Thermal Ceramic thermal conductivity 7.3 W / mK ASTM E1461
Composite thermal conductivity * 152 W / mK ASTM E1461
Thermal resistance 0.04 °C.cm 2 / W MET-5.4-01-40000
Glass transition point n/a Zero organic constituents
Maximum operating temperature 350 UL746
Electrical Volume resistivity 4 GΩ-m ASTM D257
Capacitance 430 pF / cm2 IPC-TM-650 2.5.2
Withstand voltage 100 Vac ASTM D149
Mechanical Peel strength 0.9 N / mm IPC-TM-650 2.4.8
Agency Rating & Durability Flammability V-0 UL94
Comparative traking index (CTI) 1 UL746
Multiple solder limits

200 / 180

260 / 20

280 / 20

℃ / sec UL746

*Nanotherm LC 10 * 1.0mm aluminium, ENEPIG on 1oz copper. Assumes 45 ℃ heat spreading, ignores interface resistances. 

Ref. Property / Material Parameter
Guideline
1 Sidedness
Circuit layout

Single-sided

Dual sided

Double-sided (electrical connection between circuits by vias)

2 Electrical Withstand
100VDC*
3 Aluminium alloy Area

97.2 x 97.2mm(standard)

115.0 x 165.8mm

Thickness 0.3-2.0mm, 0.5 mm (standard), 1.0 mm and 1.5 mm
Alloy 1050, 6061(standard), 6082
Warp(bow and twist) 0.50% L
Underside finish Brushed (single-sided substrates)
4 Copper tracking Thickness

17-150um (1/2-4oz)

35 um +/-10% (1 oz), standard

Track widthand gap (space between tracks)

ENEPIG finish, larger of 150 um and 2.2x copper thickness

All other finishes, larger of 75 um and 1.6x copper thickness

ADVANCED: 100umfor ENEPIG finish, 50um for all others

Track aperture (e.g. Swiss flag)

125 um (1 oz copper)

150 um (2oz copper)

175 um (4 oz copper)

Annular ring
Larger of track width and 75 um
Finish

E-NiAg (electrolytic nickel-silver), typ.5+/-2.5 um Ni, 3 +/-1 um Ag

E-NiAu (electrolytic nickel-gold), typ.5 +/-2.5 um Ni, 0.5 +/-0.125 um Au

E-NiPDAu (electrolytic nickel-palladium-gold), typ.5 +/-2.5 um Ni, 0.1 +/-0.05 um Pd, 0.1 +/-0.05 um Au

ENIG (electroless nickel-gold), typ.5 +/-2.5 um Ni, 0.5 +/-0.0125 um Au

ENEPIG (electroless nickel-palladium-gold), typ. 5 +/-2.5 um Ni, 0.1 +/-0.05 um Pd, 0.1 +/-0.05 um Au)

IAG (immersion/electroless silver), typ.> 0.3um Ag

Surface roughness

Burnished Ra 0.7um, Rz 10um

Polished Ra 0.5 um, Rz 4.5um (compatible with most wire bonding processes)

Fine polished Ra 0.4um, Rz 4um

Cut-back from routed/v-score edge or mechanical feature 250 umplus tolerance of edge/feature formation process
Mechanical registration to outline +/-25um
Minimum character height for etched nomenclature 1 mm
5 Solder mask Type LEW-3
Colour White
Thickness 20 um +/-5 um permissible range 10-50um
Line width 100 um
Cut back from routed/v-score edge or mechanical feature 100 umplus tolerance of edge/feature formation process
Relief to copper 50 um
Solder mask overlap on copper pad 100 um
Aperture opening 200 um
Character height / line width in solder mask 500/200 um
6 Ident / legend / silkscreen Colour Black, yellow
Line width 150 um
Alphanumeric character

Width 150 um

Kerning 150 um

Height 1.5 mm

Cut back from pad, routed/v-score edge or mechanical feature 200 um
Ident on pad Not permitted
7 Laser marking Laser marking

Height 80-90 umm

Width 22-25 ummm

Kerning 135-140 um

Alphanumeric character on copper

Height 84-121 um

Width 38-77 um

Kerning 140-210 um

2D bar code, on dielectric or copper 50um dot, 0.5 x 0.5 mm to 0.6 x 1.3 mm, alphanumeric capacity 3 –32 characters
Cut back from pad, edge or mechanical feature 200 um
Date / lot To panel level
8 Holes: Mechanically drilled
Diameter

200 um in <0.5 mm aluminium

400 um in 1 mm aluminium

Tolerance
+/-100 um
Registration to copper
+/-150 um
Tenting
<2.5 mm 750 um copper cut-back required for tents
9 Holes/slots:Laser drilled
Diameter
70 um entry, 60 um exit 
Tolerance
+/-15um
Registration to copper
+/-20um
Spacing
200 um
10 Slots: Routed Substrate thickness >1.0 mm
Trench width 2.0 mm
Internal radius 0.8 mm
Registration to copper +/-150um
Tenting <2.5 mm 750 um copper cut-back required for tents
11 V-score Substrate thickness >1.0 mm
Substrate dimension > 150 x 200 mm
V-cut angle 30°
Web thickness

200 um +/-100 um (1.0 mm aluminium)

300 um +/-100 um (1.5 mm aluminium)

Copper cut back from centre line 500 um
Solder mask cut back from centre line 300 um
Registration to circuit +/-250 um
Registration score-to-score +/-150 um
12 Dicing Substrate thickness < 1.0 mm
Substrate dimensions 105 x 105 mm
Copper cut-back 300 um
Solder mask cut back 250 um
Street width 200 um
Street spacing 600 um
U-channel web 150 um in 0.5 mm aluminium 200 um in 1.0 mm aluminium
13 Inspection Visual IPC-A-600H Class2and/or AABUS criteria
Electrical Open / short, withstand. Minimum pad dimension for probing 250x250 um
Mechanical precision ISO 2768 fine, med (standard), coarse
Burrs ISO 13715
Cross-out rate % or number required
14 Quality control First article inspection report Provided with first sample of each part number
Customer IQC Product specification (necessary to fix Nanotherm OQC criteria)
8D investigation report Provided where non-conformance to customer IQC or field returns are received
15 Drawings File format DXF or DWG. Drawings must include model reference and layered structure for each material (outline, copper, solder mask, vias, drill locations etc). Use 0.00 line widths for all features. Flatten drawings to remove historical layers.

* Substrate insulation capability is higher, but OQC test is limited by voltage of end-of line open/short electrical equipment.Result reported as equivalent resistance for 100V applied.

Extension
Layer
pcbname.GTL
Top copper
pcbname.GTS Top solder mask
pcbname.GT0 Top silkscreen / ident
pcbname.GBL Bottom copper
pcbname.GBS Bottom solder mask
pcbname.GBO Bottom silkscreen / ident
pcbname.TXT Hole and slot location and dimensions
pcbname.GML / GKO Board outline

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From Inquiry to Delivery 

1 Inquiry (we can design or assist in you PCB based on an electrical schematics)
Please provide as much information as possible about your product and requirements
  • Drawing(s) or description of required shape (gerber data, fabrication notes, array drawings and any special notes with requirements)
  • Operating Conditions / Application (Please provide as much information as possible)
  • Quantity
  • Delivery Request
  • Other requests or issues
2 Proposal / Quotation 
We will provide you with our proposal for a product that meets your requirements
Quote feedback: max 2 working days
3 Purchase Order
Production will begin according to the agreed-upon specifications and terms
4 Production
Sample lead time: 1 week, quick turn in 24h possible in EU plant
Producttion lead time: most orders can be delivered in 2-3 weeks depending on the complexity and volume
5 Delivery