Products

In the electronics industry 20°C temperature reduction brings significant benefits:
 
 + A quadrupling of the product life
+ Increase efficiency improved by upto 10%
+ Improve power handling improved by upto 2x

Our family of thermal management solutions are designed to deliver this benefit, whatever the unique challenge of your product

Layer of electricaly isolating alumina (Al2O3) formed on an rigid aluminium base
Ultra-thin layer of adhesive to attach a copper foil circuit trace
Composite thermal conductivity: 120 W/m
Operating temperature: 130 °C
Chip Scale Packaged (CSP) modules
Chip-on-Board LED (COB LED) modules
High density LED modules
Automotive Lighting modules
Horticultural lighting
Power semiconductors
Layer of electricaly isolating alumina (Al2O3) formed on an rigid aluminium base
Direct metallisation on alumina
Composite thermal conductivity: 152 W/m
Operating temperature: 350°C
LED chips  packaging substrate
UV LEDs
Chip Scale Packaged (CSP) modules
Chip-on-Board LED (COB LED) modules
High density LED modules
Automotive Lighting modules
Layer of electricaly isolating alumina (Al2O3) formed on an flexible aluminium base
Ultra-thin layer of adhesive to attach a copper foil circuit trace on alumina
UV LEDs
Chip Scale Packaged (CSP) modules
Chip-on-Board LED (COB LED) modules
High density LED modules
Automotive Lighting modules
Horticultural lighting
Power semiconductors
Layer of electricaly isolating alumina (Al2O3) formed on an 3D shape aluminium base
LED Ligtning
IGBTs
MOSFET