New Thinking, Cool Systems
We live in a 3D world, and yet our thinking has been driven by 2D constraints. That is changing fast. 3D design systems allow products to be visualised, 3D printers allow fantastic designs to be built rapidly – and yet the world of high power electronics is dominated by the MCPCB. Which is flat.
Do you bolt a flat MCPCB or FR4 board to a 3D heat sink, perhaps adding thermal interface Material (TIM) to try and reduce that thermal barrier between the MCPCB and the heat sink? Think of all the cost of the assembly process, the fasteners, the TIM material itself – and the loss of thermal performance as a result.
Chip on HeatSink offers an alternative. Now you can build your circuit directly onto the heatsink’s surface. This gives the shortest thermal path from the heat source, and offers an optimal thermal management solution for high power devices such as LEDs, IGBTs or MOSFETs. Electrical insulation of a conventional Aluminium heat sink is provided by application of a dielectric ceramic layer directly on its surface.
This approach eliminates cost from your design, and gives the best possible cooling. Weight is eliminated – high performance MCPCBs may even be copper, so the weight saving can be significant – and the increased thermal efficiency may mean that the heat sink can be smaller, saving even more weight and cost.
If you’d like further information please send us an email or contact us on +44 (0)1440 765520.