Cambridge Nanotherm has developed and patented a novel electro-chemical oxidation (ECO) process for converting the surface of an aluminium base of arbitrary shape in a Nanoceramic layer. The technology is principally different from anodising, microarc oxidation or galvanic deposition and produces dense nano-crystalline oxide with high thermal conductivity and dielectric strength. X-ray analysis of the Nanoceramic layers demonstrate that the ceramic layer consists of aluminium oxide crystallites with average size of around 200 – 600Å (that is 20-60 nm).
The compact nano-crystalline structure of the developed ceramic material explains its high thermal conductivity (7 W/mK) and high dielectric strength (60-110 KV/mm) which are significantly above those properties of standard Metal Clad PCB (MCPCB) dielectrics as well as anodic and Micro Arc Oxide coatings.
Due to the fully inorganic nature of the material, Nanoceramic aluminium substrates can work at high temperatures which are limited only by the working temperature of aluminium base and material properties are not affected by thermal degradation.
Nanotherm can convert the surface of any arbitrary shaped piece of aluminium into a Nanoceramic layer but as most of our applications are aimed at the electronics industry these are usually sheets of aluminium. This makes the finished Nanoceramic material as straight forward to circuitise as any other MCPCB.
Our thermal substrates are currently commercially available in two flavours:
- Nanotherm LC – the highest thermal performance MCPCB (Metal Clad PCB) on the market
- Nanotherm DM – our award winning AIN (aluminium nitride) alternative for extreme thermal management.
We also have two products that that are currently under devlopment:
- Flexible substrates – by applying our patented Nanoceramic to aluminium foil we can produce a thermally conductive, flexible, substrate that is unique in the market.
- Chip-on-Heatsink – we can integrate the thermal PCB into the heatsink – eliminating the cost of thermal interface material, assembly cost, and of course the MCPCB itself. This need not be a heatsink – it could be a structural component, a mechanical housing for an engine management system – or even mounting power transistors onto a hermetically sealed weatherproof case.
If you’d like further information regarding our Nanoceramic material please call us on +44 01440 765520 or contact us by email.