When considering IMS / MCPCB substrates, many thermal designers get fixated on thermal conductivity – but that’s only part of the story. Efficient thermal management can only be achieved by considering the whole heat path, from source to heat sink.
Think of thermal management as a journey. Like any journey, the time taken depends on two factors – speed and distance.
Thermal conductivity can be thought of as speed. With a thermal conductivity of 7W/mK, a Nanotherm dielectric is one of the most efficient available today – perhaps 3~4x better than an average material. In the “heat journey”, our heat is moving very quickly. Like a racing car, it speeds from the source to the heat sink.
However, Nanotherm dielectrics have a second advantage – they are very thin. A Nanotherm dielectric could be as thin as 3 microns – 0.003mm, or approximately 0.1mil. That is over an order of magnitude thinner than the nearest competitor, and perhaps 30~40x thinner than most dielectrics.
Returning to our racing car analogy – heat in a Nanotherm dielectric is not only travelling the fastest, it has the shortest distance to travel. Small wonder that the results achieved are consistently the best in class.