A critical aspect of the construction of an IMS or MCPCB substrate is the circuit layer. Typically copper or aluminium, this is the layer which converts the thermal substrate into an advanced thermal management component optimised for an application.
This layer can be constructed in several ways:
- Nanotherm-LC (or Laminated Copper) systems use a layer of copper foil bonded to the surface, giving class-leading performance as an MCPCB – at mass-market pricing
- Nanotherm-PM (Printed Metal) uses printed electronic techniques to directly fabricate circuits onto the NCA substrates, giving even higher thermal performance
- Nanotherm-DM (Direct Metal) uses thin-film construction techniques to atomically bond the copper layer to the NCA substrate – creating an aluminium substrate with performance to rival aluminium nitride ceramic.
Note that not all circuitization techniques are suitable for all NCA constructions, or may not be released for volume production. The following table illustrates recommended options; alternative constrcutions may be available, please contact us to discuss.
|Sheet / MCPCB||X||X|
|3D / Chip on Heat Sink||X||X|